Additives and functional resins for coatings and inks
Additives for new energy applications
Additives for semiconductor use
|
Material |
Dosage% |
Part A
|
JZ-9522 |
60 |
PMA |
39.15 |
|
Dryer(1%) |
0.3 |
|
WE-D8920CR(leveling agent) |
0.25 |
|
WE-D912R(defoamer) |
0.3 |
|
Total |
100 |
|
Part B |
N3390 |
18 |
Material |
Dosage |
JZ-9522 |
50 |
Butylated amino resin |
10 |
Solvent |
38.5 |
Adhesion promoter |
1 |
Acid catalyst |
0.5 |
Total |
100 |
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